Bureau of Educational and Cultural Affairs (ECA)

ECA Global Connections and Exchange: Youth TechCamps

Program Summary

The Office of Citizen Exchanges, Youth Programs Division, of the Bureau of Educational and Cultural Affairs (ECA) announces an open competition for a new program, Global Connections and Exchange: Youth TechCamps. Public and private non-profit organizations meeting the provisions described in Internal Revenue Code section 26 USC 501(c)(3) may submit proposals to conduct seven- to ten-day, academically rigorous technology camps overseas for youth. The camps will be held in four to five of the eligible countries/republics (listed in the RFP), primarily in calendar year 2014. Through these intensive, in-person technology camps and follow-on virtual exchange components, up to 210 competitively selected U.S and non-U.S. secondary school students will be provided the opportunity to build their digital literacy skills, expand their understanding of the vast array of online resources that can be utilized to promote community engagement and foster change within their communities, and gain a deeper understanding of other countries’ cultures.


Organizations may submit only one proposal (total) under this competition.

Award Information

It is the Bureau’s intent to award up to two cooperative agreements for an estimated total amount of $500,000.

It is anticipated that the award period will begin on or around September 1, 2013, and the camps will take place primarily in 2014. The Youth Programs Division anticipates awarding up to two cooperative agreements to U.S. organizations to design and implement the in-country technology camps and virtual exchange components, in collaboration with their in-country partners and participating U.S. embassies. Each cooperative agreement will be for up to a two-year period.

To comply with the limitation of one submission per organization, please contact Cheryl Ridgeway (cheryl-a-ridgeway@uiowa.edu or 384-3332) in the Office of the Vice President for Research, if you are interested in applying.

Date Due to DSP or UIF05/21/2013
Date Due to Sponsor05/28/2013
Required LOI Due DateN/A
Non-Required LOI Due DateN/A
Sponsor URL:http://www.grants.gov/search/search.do?mode=VIEW&oppId=231097

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